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Manufacturer Part #
R5F51308AGFP#30
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90 per Tray
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Description of Change: Applicable products: RX Family RX100/200/600/700 Series LQFP-64 and LFQFP-80/100/144 pin products.The back-end factory: Renesas Semiconductor (Beijing) Co., LtdChanges: The lead frame will be changed.Reason for Change: To ensure a stable supply.
Description of Change: Change of lead frame. The wire length between the chip and lead frame inside the package is shortened at the inner lead portion. Package outline, die bond, mold resin and marking remain unchanged. Reason for Change: To ensure stable supply
Description of Change:Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).Reason for Change:The new materials are already proven and used for other products in RSB assembly.No samples planned because the changed materials are already well known and used in mass production for other products.To ensure stable supply
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.