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SY898535LKY
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74 per Tube
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Product Category: Clock And Timing - Clock And Data Distribution, Clock BuffersDescription of Change: Qualification of CRM 1076 NS as a new die attach material and G700HC as a new molding compound material for selected SY100EP57, SY100EP56, SY898533L, SY898535L, SY898535XL, SY75576L, SY100EP14U and SY89645L device families available in 20L TSSOP (4.4mm) package at UNIS assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM 1076 NS as a new die attach material and G700HC as a new molding compound material at UNIS assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2027
*** Update of FPCN 115179 , 121897 & 122144 /MULTIPLE CHANGE***Revision History: Note: See attached SPCN document for more Revision historyJune 25, 2026: Re-issued the final notification to include notes on the impacts to datasheet.Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 23 December 2026Estimated First Ship Date: 18 June 2026 (date code: 2625)
*** Update of FPCN 115179 & 121897 ***Revision History: August 07, 2025: Issued initial notification.June 08, 2026: Issued final notification. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on June 18, 2026.June 22, 2026: Re-issued final notification. Revised the PCN Timetable Summary to update the "Qual Report Availability" to December 23, 2026 (Week 52)Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: See attached SPCN document for more detailsEstimated Qualification Completion Date: 23 December 2026Estimated First Ship Date: 18 June 2026
*** Update of FPCN 115179 ***Revision History: August 07, 2025: Issued initial notification.June 08, 2026: Issued final notification. Added a Change (Yes/No) column to the Pre and Post Change Summary table. Provided estimated first ship date to be on June 18, 2026.Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 01 June 2028Estimated First Ship Date: 18 June 2026 (date code: 2625)
Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
