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Référence fabricant
NC7WZ16L6X
NC7WZ16 Series 5.5 V Surface Mount TinyLogic UHS Dual Buffer - MICROPAK-6
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| Nom du fabricant: | onsemi | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MICROPAK-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2448 | ||||||||||
onsemi NC7WZ16L6X - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=NC7WZ16L6X&field4=onsemi&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--gates--dual-gate/nc7wz16l6x-onsemi-2192041
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=NC7WZ16L6X&field4=onsemi&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--gates--dual-gate/nc7wz16l6x-onsemi-2192041
onsemi NC7WZ16L6X - Caractéristiques techniques
| Logic Circuit: | Buffer |
| No of Functions / Channels: | 2 |
| Supply Voltage-Nom: | 1.65V to 5.5V |
| Style d'emballage : | MICROPAK-6 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The NC7WZ16L6X is a part of NC7WZ16 Series dual buffer from Ultra- High Speed Series of TinyLogic®. The device is specified to operate over the 1.65 V to 5.5 V VCC range.
The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The inputs and outputs are high impedance when VCC is 0 V. Inputs tolerate voltages up to 7 V independent of VCC operating voltage
Features:
- Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at 5 V VCC
- High Output Drive: ±24mA at 3 V VCC
- Broad VCC Operating Range: 1.65 V to 5.5 V
- Matches Performance of LCX when Operated at 3.3 V VCC
- Power Down High-Impedance Inputs/Outputs
- Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
- Proprietary Noise/EMI Reduction Circuitry
- Ultra-Small MicroPak™ Packages
- Space-Saving SC70 Package
Applications:
- Automation
- Broadband Access
- Broadband Modem
- Broadcast & Studio
- Building & Home Control
- Consumer Appliances
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MICROPAK-6
Méthode de montage :
Surface Mount