Manufacturer Part #
SY58035UMG
SY58035U Series 2.5/3.3 V 4.5 GHz 1:6 LVPECL Fanout Buffer with 2.1 MUX - MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tube Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2334 | ||||||||||
Microchip SY58035UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
Revision History: June 17, 2025: Issued initial notification.June 20, 2025: Re-issued initial notification to update the Pre and Post Change Summary attachment.June 26, 2025: Re-issued initial notification to correct the typo error in the Pre and Post Change Summary attachment.Description of Change:Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site
Revision History:June 17, 2025: Issued initial notification.June 20, 2025: Re-issued initial notification to update the Pre and Post Change Summary attachment.Description of Change:Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Pre and Post Summary Changes: See attached documentImpacts to Datasheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: August 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached document
Description of Change: Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY58035UMG - Technical Attributes
| Type: | Clock Buffer |
| Clock Output Frequency - Max: | 4.5GHz |
| Supply Voltage-Nom: | 2.5V to 3.3V |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY58035UMG is a Part of SY58035U Series, 2.5 V/3.3 V precision, high-speed, 1:6 fanout capable of handling clocks up to 4.5 GHz. A differential 2:1 MUX input is included for redundant clock switchover applications. It comes in a Package of MLF-32 and its operting temperature ranges from -40 °C to 85 °C.
Features:
- Provides 6 ultra-low skew copies of the selected input
- 2:1 MUX input included for clock switchover applications
- Guaranteed AC performance over temperature and voltage:
- Clock frequency range:DC to >4.5 GHz
- <350 ps IN-to-OUT tpd
- <110 ps tr/tf times
- <20 ps skew (output-to-output)
- Ultra-low jitter design:
- 50 fsRMS Phase Jitter (Typ)
- Low supply voltage operation:2.5 V and 3.3 V
- Unique input termination and VT pin accepts DC-coupled and AC-coupled inputs (CML, PECL, LVDS)
- Unique input isolation design minimizes crosstalk
- 100 k LVPECL compatible output swing
Applications:
- Redundant clock distribution
- All SONET/SDH clock/data distribution
- All Fibre Channel distribution
- All Gigabit Ethernet clock distribution
Available Packaging
Package Qty:
60 per Tube
Package Style:
MLF-32
Mounting Method:
Surface Mount