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Manufacturer Part #
24LC32AFT-I/OT
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3000 per Reel
SOT-23 (SC-59,TO-236)
Surface Mount
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Product Category: MemoryNotification Subject: CCB 7789.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA32A, 24AA32AF, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS64, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC256, 24FC64, 24FC64F, 24LC32A, 24LC32AF, 24LC64, 24LC64F, AT24C32 and AT24C32E device families available in 5L SOT-23 package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA32A, 24AA32AF, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS64, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC256, 24FC64, 24FC64F, 24LC32A, 24LC32AF, 24LC64, 24LC64F, AT24C32 and AT24C32E device families available in 5L SOT-23 package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Change Implementation Status: In ProgressEstimated First Ship Date: 23 September 2026 (date code: 2639)
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Microchip has released a new Datasheet for the 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change: Corrected package offerings in the ?Automotive Product Identification System? section; Minor formatting changes.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the 24AA32AF/24LC32AF 32-Kbit I2C Serial EEPROM with Quarter-Array Write-Protect Data Sheet of devices.Notification Status: FinalDescription of Change:Updated formatting to current template; Updated MSOP, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Replaced ?Automotive (E):? designation with ?Extended (E):? designation.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 21 Sep 2022
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