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Manufacturer Part #
24LC32AT-I/MS
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2500 per Reel
MSOP-8
Surface Mount
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PCN Information:
Product Category: MemoryNotification Subject: CCB 7788.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 14 September 2026 (date code: 2638)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Microchip has released a new Datasheet for the 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change: Corrected package offerings in the ?Automotive Product Identification System? section; Minor formatting changes.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
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