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Manufacturer Part #
24LC32AT/SM
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2100 per Reel
SOIJ-8
Surface Mount
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Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of QMI-519 die attach material at MTAI assembly site for 24LC32A/SM, 24LC32A-E/SM, 24AA32AT-I/SM, 24LC32AT/SM, 24AA64T-I/SM, 24LC64T-E/SM, 24AA32AT/SM, 24LC64T-I/SM, 24FC64-I/SM, 24FC64T-I/SM, 24LC64-I/SM, 24LC64-E/SM, 24AA64-I/SM, 24AA32A-I/SM, 24LC32A-I/SM, 24LC32AT-I/SM, 24LC32AT-E/SM, 24AA64T-E/SM and 24AA64-E/SM catalog part numbers (CPN) available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on time delivery performance by qualifying QMI-519 die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Microchip has released a new Datasheet for the 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change: Corrected package offerings in the ?Automotive Product Identification System? section; Minor formatting changes.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
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