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Manufacturer Part #
24LC515T-I/SM
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2100 per Reel
SOIJ-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
PCN Status:Final NotificationDescription of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24LC515, 24AA515, and 24FC515 device families available in 8L SOIJ (.208in) and 8L PDIP (.300in) packages.Reason for Change:To improve manufacturability by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new wafer fabrication site.
Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24LC515, 24AA515, and 24FC515 device families available in 8L SOIJ (.208in) and 8L PDIP (.300in) packages.Reason for Change:To improve manufacturability by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new wafer fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2023
Part Status:
The 24LC515T-I/SM is a Part of 24LC515 Series with 2.5 V to 5.5 V 512 kBit I2C 2 Wire Serial EEPROM available in Surface mount TSSOP-14 Package. The 512 kbit is organised into 64K X 8 bit Memory.
It has been developed for advanced, low-power applications such as personal communications or data acquisition.
Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.