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Manufacturer Part #
AT24C01C-SSHM-B
AT24C01C Series 1 Kb (128 x 8) 1.7 V I2C Compatible Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2303 | ||||||||||
Microchip AT24C01C-SSHM-B - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN112076 & PCN114907***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025. August 6, 2025: Re-issued final notification to update the attachment.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
***UPDATE OF PCN112076***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C04C, AT24C02C, AT24C01C, AT24C32D, AT24C256C, ATtiny25, ATtiny13A, ATtiny13, 25LC256, 25AA256, 25LC128 and 25AA128 device families available in 8L SOIC (.150in).Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5). Estimated Qualification Completion Date: May 2025
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C01C-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c01c-sshm-b-microchip-2107014
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C01C-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c01c-sshm-b-microchip-2107014
Microchip AT24C01C-SSHM-B - Technical Attributes
| Memory Density: | 1kb |
| Memory Organization: | 128 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount