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Manufacturer Part #
AT24C01D-MAHM-T
AT24C01D Series 1 Kb (128 x 8) I2C-Compatible (2-wire) Serial EEPROM - UDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:UDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip AT24C01D-MAHM-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.February 15, 2024: Re-issued to correct the Pre-change site from ANAP to ATP7Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying ATP7 as an additional test location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.Estimated Qualification Completion Date:June 2023
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for various Atmel products available in 8L UDFN (2x3x0.6mm) package.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2022 (date code: 2208)
Part Status:
Microchip AT24C01D-MAHM-T - Technical Attributes
| Memory Density: | 1kb |
| Memory Organization: | 128 x 8 |
| Supply Voltage-Nom: | 1.7V to 3.6V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | UDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount