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Manufacturer Part #
AT24C512C-SHD-T
AT24C512C Series 512 Kb (64 K x 8) 2.5 V I2C-Compatible Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2000 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status: Final notification.PCN Type:Manufacturing ChangeDescription of Change:Qualification of 66.88K process technology for selected Microchip products of the AT24C512C device familyImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:August 2, 2021 (date code: 2132)
Description of Change:Qualification of MTAI as a new assembly site for AT24C512C-SHM-B, AT24C512C-SHD-B, AT24C512C-SHD-T and AT24C512C-SHM-T Atmel catalog part numbers (CPN) available 8L SOIJ (.208in) package.Pre and Post Change Summary:See attachedReason for Change:To improve on-time delivery performance by qualifying MTAI as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:June 11, 2021 (date code: 2124)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:See attachedRevision History:May 31, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 11, 2021.
Description of Change:1. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively. Added note to Table 4-6 that explains the array architecture and how endurance is specified. Updated TSSOP and UDFN package drawings. Reason for Change: To Improve Productivity Date Document Changes Effective: 23 Apr 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the AT24C512C - Complete Datasheet of devices.Description of Change:1) Revised Noise Suppression Time (tI) from 100 ns to 50 ns.2) Updated SOIC 8-Lead package drawing3) Minor text changes throughout.oneReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 20 Mar 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:1) Updated to the Microchip template and Microchip DS20006161 replaces Atmel document 8720.2) Corrected tLOW typo from 400 ns to 500 ns and tAA typo from 550 ns to 450 ns.3) Deleted the AT24C512C?CUMHY?T package options.4) Updated Part Marking Information.5) Updated the “Software Reset” section. Added ESD rating.6) Removed lead finish designation.7) Updated trace code format in package markings.8) Updated section content throughout for clarification.9) Added a figure for “System Configuration Using Two?Wire Serial EEPROMs”.10) Added POR recommendations section.11) Updated the SOIC, SOIJ, TSSOP and UDFN package drawings to Microchip format.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 07 Mar 2019.NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Technical Attributes
| Memory Density: | 512kb |
| Memory Organization: | 64 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2000 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount