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Référence fabricant
93C46BT-I/OT
93C46 Series 1 Kbit (64 x 16) 5.5 V Microwire Compatible Serial EEPROM -SOT-23-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Std. Mfr. Pkg Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip 93C46BT-I/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=93C46BT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--micro-wire-interface-protocol/93c46bt-i-ot-microchip-C016262682
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=93C46BT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--micro-wire-interface-protocol/93c46bt-i-ot-microchip-C016262682
Microchip 93C46BT-I/OT - Caractéristiques techniques
| Memory Density: | 1kb |
| Memory Organization: | 64 x 16 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Clock Frequency-Max: | 2MHz |
| Write Cycle Time-Max (tWC): | 6ms |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 93XX46B devices are 1 Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA46C, 93LC46C or 93C46C are dependent upon external logic levels driving the ORG pin to set word size.
Advanced CMOS technology makes these devices ideal for lowpower, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.
Features:
- Low-Power CMOS Technology
- ORG Pin to Select Word Size for ‘46C’ Version
- 128 x 8-bit Organization ‘A’ Devices (no ORG)
- 64 x 16-bit Organization ‘B’ Devices (no ORG)
- Self-Timed Erase/Write Cycles (including Auto-Erase)
- Automatic Erase All (ERAL) Before Write All (WRAL)
- Power-On/Off Data Protection Circuitry
- Industry Standard 3-Wire Serial I/O
- Device Status Signal (Ready/Busy)
- Sequential Read Function
- 1,000,000 Erase/Write Cycles
- Data Retention > 200 Years
- Temperature ranges supported:
- Industrial (I) -40°C to +85°C
View the complete product family of 93C46 Series
Emballages disponibles
Qté d'emballage(s) :
3000 par Std. Mfr. Pkg
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount
