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Manufacturer Part #
25LC256-I/SM
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90 per Tube
SOIJ-8
Surface Mount
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PCN Information:
Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected 25AA128, 25AA256, 25LC128, 25LC256, AT25256B, AT25M01, ATtiny13, ATtiny13A, ATtiny25, ATtiny45 and ATtiny85 device families available in 8L SOIJ (.208in) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated First Ship Date: 10 July 2026 (date code: 2628)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
The 25LC256 (25XX256*) are 256 Kbit Serial Electrically Erasable PROMs. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input.
Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 25XX256 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead DFN and 8-lead TSSOP
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.