Manufacturer Part #
IC EEPROM 2MBIT 5MHZ 8SOIC
AT25M02 - Complete Datasheet Document RevisionDescription of Change: 1) Updated to Microchip template. Microchip DS20006230 replaces Atmel document 8832. 2) Updated Part Marking Information. 3) Added ESD rating. 4) Removed lead finish designation. Changed Data Retention spec to 100 year. 5) Updated trace code format in package markings. 6) Updated section content throughout for clarification. 7) Updated the SOIC package drawing to the Microchip equivalent.Reason for Change: To Improve ManufacturabilityPlease be advised that this is a change to the document only the product has not been changed
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSHASSEMBLY SITE:Pre Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,G700 molding compound material and NiPdAu lead finish.Post Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,CEL-9240HF10AK molding compound material and Matte Tin lead finishReason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date:May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change:Traceability codeQualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual ReportRevision History:June 15, 2017:Issued initial notification.June 20, 2017: Re-issued initial notification to include affected parts list and qualification plan.June 23, 2017:Re-issued initial notification to correct a typo on molding compound material from CEL-9240HF10AK and G700A/G700LS to G700.July 13, 2017:Re-issued initial notification to include ANAP Assembly site in the post change.April 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on May 27, 2018.The change described in this PCN does not alter Microchip�s current regulatory complianceregarding the material content of the applicable products.