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Manufacturer Part #
AT27C040-70JU
AT27C040 Series 4 Mb (512 K x 8) 70 ns 5.5 V SMT OTP EPROM - PLCC-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:32 per Tube Package Style:PLCC-32 Mounting Method:Surface Mount | ||||||||||
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Microchip AT27C040-70JU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 112961 ***Description of Change: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated First Ship Date: 12 October 2025 (date code: 2541)Revision History:April 30, 2025: Issued initial notification.September 18, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 12, 2025.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated Qualification Completion Date: June 2025
PCN Status:Final NotificationDescription of Change:Qualification of MMT as a new assembly site for selected Atmel AT27C040, AT27C080 and AT27LV040A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability by qualifying MMT as new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:August 05, 2024 (date code: 2432)
Revision History:April 16, 2021: Issued initial notification.May 30, 2024: Re-issued initial notification to update PCN Time Table Summary. Updated Qualification Plan from MSL-2 to MSL-3.Description of Change:Qualification of MMT as a new assembly site for selected Atmel AT27C040, AT27C080 and AT27LV040A device families available in 32L PLCC (11.5x14x3.37mm) package. Pre and Post Change Summary: See attached document Reason for Change:To improve manufacturability by qualifying MMT as new assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT27C040-70JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eprom--otp-eprom/at27c040-70ju-microchip-8073939
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT27C040-70JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eprom--otp-eprom/at27c040-70ju-microchip-8073939
Microchip AT27C040-70JU - Technical Attributes
| Memory Density: | 4Mb |
| Memory Organization: | 512 K x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Access Time-Max: | 70ns |
| Temperature Grade: | Industrial |
| Package Style: | PLCC-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
32 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount