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Manufacturer Part #
AT27C1024-45PU
EPROM - OTP Memory IC 1Mb (64K x 16) Parallel 45ns 40-PDIP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:10 per Tube | ||||||||||
| Date Code: | 2045 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Reissued final notification. Corrected tolerance typo contained in Pre and Post Change document.Description of Change:Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products.Pre Change: Tested at MPHIL final test site.Post Change: Tested at MMT final test site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:June 25, 2020: Issued initial notification.July 14, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 17, 2020.July 28, 2020: Reissued final notification. Reattached the qualification report. Corrected the pin orientation within the PCN letter. Corrected titles contained in page 5 and 6 of the Pre and Post Change document.August 5 & 6, 2020: Reissued final notification. Corrected tolerance typo and lead count typo contained in Pre and Post Change document.August 11, 2020: Reissued final notification. Corrected tolerance typo contained in Pre and Post Change document.Description of Change:Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products.Pre Change:Tested at MPHIL final test site.Post Change:Tested at MMT final test site.Reason for Change:To improve manufacturability by qualifying MMT as a new final test site.Estimated First Ship Date:August 17, 2020 (date code: 2034)
Revision History:June 25, 2020: Issued initial notificationJuly 14, 2020: Issued final notification. Attached thequalification report. Provided estimated first ship date to be on August 17, 2020.July 28, 2020: Reissued final notification.Reattached the qualification report. Corrected the pin orientation within the PCN letter. Corrected titles contained in page 5 and 6 of the Pre and Post Change document.August 5 & 6, 2020: Reissued final notification. Corrected tolerance typo and lead count typo contained in Pre and Post Change document.
Revision History:June 25, 2020: Issued initial notification.July 14, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 17, 2020.July 28, 2020: Reissued final notification. Reattached the qualification report. Corrected the pin orientation within the PCN letter. Corrected titles contained in page 5 and 6 of the Pre and Post Change document.August 5, 2020: Reissued final notification. Corrected tolerance typo contained in Pre and Post Change document.
PCN Status:Final notificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products.Pre Change:Tested at MPHIL final test site.Post Change:Tested at MMT final test site.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying MMT as a new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:August 17, 2020 (date code: 2034)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Description of Change:Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products.Revision History:June 25, 2020: Issued initial notification.July 14, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 17, 2020.Pre Change:Tested at MPHIL final test site.Post Change:Tested at MMT final test site.Reason for Change:To improve manufacturability by qualifying MMT as a new final test site. Estimated First Ship Date:August 17, 2020 (date code: 2034)
PCN Status:Final notificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products.Pre Change:Tested at MPHIL final test site.Post Change:Tested at MMT final test site.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying MMT as a new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:August 17, 2020 (date code: 2034)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Revision History:May 29, 2017: Issued initial notification.November 07, 2017: Re-issued initial notification to update the affected parts list. Updated the pre and post change to include die coat material. Updated the qual report availability and revision of the qualification plan.August 22, 2018: Issued final notification. Attached the Qualification Report. Added reference CCB 2936.001 and updated affected CPN list because of the update in the scope of this PCN.April 01, 2019: Re-issued final notification. Amended reference CCB 2936.001 to CCB 2936.002 and added reference CCB 2936.003 to include selected Atmel products available in 28L PDIP package. Updated notification subject, description of change, pre and post change field and summary table and the affected CPN list in accordance with the scope.Description of Change:Qualification of MMT as a new assembly site for selected Atmel Product available in 28L and 40L PDIP package.Pre Change:Assembled at ANAP assembly site using 8390A die attach, Q3-6646 die coat and CK5000A molding compound material. Assembled at LPI assembly site using CRM-1033BF die attach, Q1-4939 die coat and G600 molding compound material.Post Change: Assembled at MMT Assembly site using CRM-1064L die attach, Q1-4939 die coat and GE800 molding compound material.Reason for Change:To improve manufacturability by qualifying MMT assembly site as part of the Atmel and Microchip integration.Estimated First Ship Date:For 40L PDIP package: September 21, 2018 (date code: 1838).For 28L PDIP package: May 01, 2019 (date code: 1918)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Description of Change:Implement MMT shipping tube for selected Atmel products available in 20L PDIP (300 mils), 28L PDIP, 40L PDIP (600 mils), 28L PLCC and 44L PLCC packages.Pre Change: Using MPHL shipping tubePost Change: Using MPHL and MMT shipping tube.Reason for Change:To improve on-time delivery performance by qualifying MMT shipping tube.Estimated First Ship Date:October 12, 2018 (date code: 1841)
Part Status:
Available Packaging
Package Qty:
10 per Tube