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Manufacturer Part #
24AA256T-E/MNY
24AA256 Series 256 Kb (32K x 8) 5.5 V Surface Mount I2C Serial EEPROM - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 24AA256T-E/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
PCN Status:Final NotificationDescription of Change:Qualification of UMC Fab 8D as an additional fabrication site for selected 24FC256, 24AA256 and 24LC256 device families available in 8L DFN-S (6x5x0.9mm), MSOP (3x3mm), PDIP (.300in), SOIC (3.90mm), SOIJ (.208in), TDFN (2x3x0.8mm), TSSOP (4.4mm) packages.Reason for Change:To improve manufacturability by qualifying UMC Fab 8D as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:September 19, 2022 (date code: 2239)
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA256T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/24aa256t-e-mny-microchip-1089116
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA256T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/24aa256t-e-mny-microchip-1089116
Microchip 24AA256T-E/MNY - Technical Attributes
| Memory Density: | 256kb |
| Memory Organization: | 32Kx8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Access Time-Max: | 900ns |
| Interface: | I2C |
| Temperature Grade: | Automotive |
| Operating Temp Range: | -40°C to +125°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount