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Manufacturer Part #
AT24HC02C-XHM-B
AT24HC02C Series 2 Kb (256 x 8) I2C-Compatible (2-wire) Serial EEPROM - TSSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:TSSOP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip AT24HC02C-XHM-B - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for AT24C01C-XHM-B, AT24C01C-XHM-T, AT24C02C-XHM-B, AT24C02C-XHM T, AT24C04C-XHM-B, AT24C04C-XHM-T, AT24HC02C-XHM-B, AT24HC02C-XHM-T, AT24HC04B-TH-B and AT24HC04B-TH-T catalog part numbers (CPN) available in 8L TSSOP (4.4mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 30 September 2025 (date code: 2540)
***UPDATE OF PCN112076 & PCN114907***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025. August 6, 2025: Re-issued final notification to update the attachment.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
***UPDATE OF PCN112076***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5). Estimated Qualification Completion Date: May 2025
Description of Change: Qualification of ANAP as an additional assembly site for AT24C02C-XHM-T-834, AT24HC02C-XHM-B, AT24HC02C-XHM-T, AT24HC04B-TH-B, AT24HC04B-TH-T, AT24MAC402-XHM-B, AT24MAC402-XHM-T, AT24MAC602-XHM-B, AT24MAC602-XHM-T, AT34C02C-TH-T-834, AT93C46D-TH-T-834, AT93C46E-TH-B and AT93C46E-TH-T catalog part numbers (CPN) available in 8L TSSOP (4.4mm) package.Reason for Change: To improve on-time delivery performance by qualifying ANAP as an additional assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24HC02C-XHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/at24hc02c-xhm-b-microchip-2107006
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24HC02C-XHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/at24hc02c-xhm-b-microchip-2107006
Microchip AT24HC02C-XHM-B - Technical Attributes
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Access Time-Max: | 550ns |
| Interface: | I2C/Serial |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | TSSOP-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Tube
Package Style:
TSSOP-8
Mounting Method:
Surface Mount