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Manufacturer Part #
CY7C1011DV33-10ZSXI
CY7C1011DV33 Series 2 Mb (128 K x 16) 3.3 V 10 ns Static RAM - TSOP-44
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:135 per Tray Package Style:TSOP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1737 | ||||||||||
Cypress CY7C1011DV33-10ZSXI - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes.
Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products Description of Change: Cypress announces the qualification of Daewon tray to be used for 44-Lead TSOP II package tested and finish processed at ChipMOS Technologies Inc., Taiwan. This tray is qualified and currently in use by Cypress and its other Test and Finish subcons. This tray is compatible to industry standard as this tray is aligned to JEDEC requirements.
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package Description of Change: Cypress announces the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory products offered in 44-Lead TSOP II package.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Part Status:
Cypress CY7C1011DV33-10ZSXI - Technical Attributes
| Memory Density: | 2Mb |
| Memory Organization: | 128 K x 16 |
| Supply Voltage-Nom: | 3.3V |
| Access Time-Max: | 10ns |
| Temperature Grade: | Industrial |
| Package Style: | TSOP-44 |
| Mounting Method: | Surface Mount |
$Features & Applications
The CY7C1011DV33 is available in standard Pb-free 44-pin TSOP II with center power and ground pinout, as well as 48-ball very fine-pitch ball grid array (VFBGA) packages.
Features:
- Pin-and function-compatible with CY7C1011CV33
- High speed
- tAA = 10 ns
- Low active power
- ICC = 90 mA @ 10 ns (Industrial)
- Low CMOS standby power
- ISB2 = 10 mA
- Data Retention at 2.0 V
- Automatic power-down when deselected
- Independent control of upper and lower bits
- Easy memory expansion with CE and OE features
- Available in Pb-free 44-pin TSOP II, and 48-ball VFBGA
Available Packaging
Package Qty:
135 per Tray
Package Style:
TSOP-44
Mounting Method:
Surface Mount