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Manufacturer Part #
CY7C1011DV33-10ZSXI
CY7C1011DV33 Series 2 Mb (128 K x 16) 3.3 V 10 ns Static RAM - TSOP-44
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:135 per Tray Package Style:TSOP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1737 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products Description of Change: Cypress announces the qualification of Daewon tray to be used for 44-Lead TSOP II package tested and finish processed at ChipMOS Technologies Inc., Taiwan. This tray is qualified and currently in use by Cypress and its other Test and Finish subcons. This tray is compatible to industry standard as this tray is aligned to JEDEC requirements.
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package Description of Change: Cypress announces the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory products offered in 44-Lead TSOP II package.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
The purpose of this addendum is to remove the non-BGA marketing part numbers from the Affected Parts List that are not included in this change.Description of Change: The purpose of this addendum is to remove the non-BGA marketing part numbers from the Affected Parts List that are not included in this change. Cypress announced the addition of a serial number, called "unit code", to the top mark of BGA products at Cypress Bangkok. This unit code will be implemented on products in the BGA package families. The unit code will enhance the traceability to specific Assembly equipment used for any single unit. The attached file includes pictures that show the unit code top mark location for the various package sizes affected by this change.
Description of Change: Cypress announces the addition of a serial number, called "unit code", to the top mark of select Flash and SRAM products at Cypress Bangkok. This unit code will be implemented on products in the BGA package families. The unit code will enhance the traceability to specific Assembly equipment used for any single unit. Benefit of Change: Cypress Bangkok will have an enhanced capability for unit level traceability. The additional serial number, or "unit code", top marked on the product will enable traceability to the specific equipment used in all key Assembly processes quickly and accurately. This will in turn allow for faster response time to our customers. Approximate Implementation Date: This change will be effective upon customer approval for Automotive PPAP part numbers and 90 days from the date of this notification for Standard part numbers. Old assembly seal date codes before this PCN implementation will not include the unit code in the top mark. Thus, within the same shipment, there may be units both with and without the unit code in the top mark until the old inventory has been depleted.Document No. 001-11767 Rev. *I Page 2 of 2 Anticipated Impact: Products assembled at the new site are completely compatible with existing products from form, fit, functional, parametric, and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Part Status:
Technical Attributes
| Memory Density: | 2Mb |
| Memory Organization: | 128 K x 16 |
| Supply Voltage-Nom: | 3.3V |
| Access Time-Max: | 10ns |
| Temperature Grade: | Industrial |
| Package Style: | TSOP-44 |
| Mounting Method: | Surface Mount |
Features & Applications
The CY7C1011DV33 is available in standard Pb-free 44-pin TSOP II with center power and ground pinout, as well as 48-ball very fine-pitch ball grid array (VFBGA) packages.
Features:
- Pin-and function-compatible with CY7C1011CV33
- High speed
- tAA = 10 ns
- Low active power
- ICC = 90 mA @ 10 ns (Industrial)
- Low CMOS standby power
- ISB2 = 10 mA
- Data Retention at 2.0 V
- Automatic power-down when deselected
- Independent control of upper and lower bits
- Easy memory expansion with CE and OE features
- Available in Pb-free 44-pin TSOP II, and 48-ball VFBGA
Available Packaging
Package Qty:
135 per Tray
Package Style:
TSOP-44
Mounting Method:
Surface Mount