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Manufacturer Part #
MR10Q010SC
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480 per Tray
SOIC-16
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Title OSE Material Change 1Mb SOIC 16 PackageDescription:Bond Wire change for the 1Mb SOIC 16Reason For ChangeAuPdCu wires have lower cost, and better conductivity.Proposed First Ship Date for Change: 8/27/2026
******FPCN107253 UPDATE******Corrected site code from O to S.
******FPCN109007 UPDATE******Updated PCN supplier Code from O to S.
Description: OSE Material Change SOIC16 1 MB Package.Type: Major Change Die Thickness and Au Wire for the 1Mb SOIC16Reason For Change: Long term improvement for device reliability.
Type: Major ChangeEverspin is qualifying OSE as a 2nd manufacturing site for the 1Mb SOIC16L device. Reason For ChangeAdding additional site for manufacturing.
Type: Major ChangeEverspin is replacing the current lead frame vendor with a lead frame already in use in a different Everspin product packaged at OSE.Reason For ChangeReplacement of the Stamped Ag Ring plated lead frame to align with other Everspin product lead frame material.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.