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Manufacturer Part #
23K640-I/SN
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100 per Tube
SOIC-8
Surface Mount
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PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for 23A256-I/SN, 23A256T-I/SN, 23A640-I/SN, 23A640T-I/SN, 23K256-E/SN, 23K256-I/SN, 23K256T-E/SN, 23K256T-I/SN, 23K640-E/SN, 23K640-I/SN, 23K640T-E/SN and 23K640T-I/SN catalog part numbers (CPN) available in 8L SOIC (3.90mm) package at MTAI assembly site.Pre and Post Summary Changes: See attched SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Description of Change: Updated section 2.1 “Principles of Operation”.Reason for Change: To Improve Productivity
Part Status:
The 23X640 are 64 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input.
Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X640 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.