
Manufacturer Part #
23K640-I/P
23K640 Series 2.7 V to 3.6 V 64 kbit SPI Bus Low-Power Serial SRAM - PDIP-8
Microchip 23K640-I/P - Product Specification
Shipping Information:
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PCN Information:
Microchip has released a new Datasheet for the 23A640/23K640 64-Kbit SPI Bus Low-Power Serial SRAM Data Sheet of devices. Description of Change: Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively; Updated PDIP and SOIC package drawings; Added Automotive Product Identification System..Reason for Change: To Improve Productivity
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Part Status:
Microchip 23K640-I/P - Technical Attributes
Package Style: | PDIP-8 |
Mounting Method: | Through Hole |
$Features & Applications
The 23X640 are 64 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input.
Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X640 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.
Features:
- Max. Clock 16 MHz
- Low-Power CMOS Technology: - Read Current: 3 mA at 1 MHz - Standby Current: 4 μA Max. at 3.6 V
- 8192 x 8-bit Organization
- 32-Byte Page
- HOLD pin
- Flexible Operating modes:- Byte read and write - Page mode (32 Byte Page) - Sequential mode
- Sequential Read/Write
Available Packaging
Package Qty:
60 per Tray
Package Style:
PDIP-8
Mounting Method:
Through Hole