Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
DSPIC33CDV64MC106-E/M8
Download the CAD models for this product. Learn more about SnapMagic.
40 per Tube
VGQFN-64
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 109558 & 119298 ***Revision History: December 10, 2024: Issued initial notification.February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Updated parts list to include (See attached SPCN document for more details June 22, 2026: Re-issued final notification to attach the Qualification Report. Update the timetable summary for Qual Report availability.Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506 and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Change Implementation Status: In ProgressEstimated First Ship Date: 10 June 2026 (date code: 2624)
*** Update of DPCN 109558 ***February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Reason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 27 February 2026 (date code: 2609)
Microchip has released a new Document for the dsPIC33CDVL64MC106 Family Silicon Errata and Data Sheet Clarification of devices. Description of Change:Added data sheet clarification 1 (MOSFET Gate Driver). Reason for Change: To improve productivity.
Description of Change:Added silicon revision D3.Added silicon issue 10 (MOSFET Gate Driver).Reason for change: To Improve Productivity
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
