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Référence fabricant
DSPIC33CK256MC005-I/PT
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250 par Tray
TQFP-48
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: 32-Bit Microcontrollers, Digital Signal ControllersNotification Subject: CCB 8307 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.