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Manufacturer Part #
DSPIC33CK64MC102-I/M6
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91 per Tube
UQFN-28
Surface Mount
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HTS Code:
ECCN:
PCN Information:
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected dsPIC33CK64MP102xxx, dsPIC33CK64MC102xxx, dsPIC33CK32MC102xxx, dsPIC33CK256MC502xxx, dsPIC33CK128MC502xxx, dsPIC33CK256MC102xxx, dsPIC33CK128MC102xxx and dsPIC33CK32MP102xxx device families available in 28L UQFN (4x4x0.6mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected dsPIC33CK64MP102xxx, dsPIC33CK64MC102xxx, dsPIC33CK32MC102xxx, dsPIC33CK256MC502xxx, dsPIC33CK128MC502xxx, dsPIC33CK256MC102xxx, dsPIC33CK128MC102xxx and dsPIC33CK32MP102xxx device families available in 28L UQFN (4x4x0.6mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023
Description of Change:Qualification of MMT as an additional assembly site for selected DSPIC33CK32Mx102 and DSPIC33CK64Mx102 device families available in 28L UQFN (4x4x0.6mm) package.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:March 21, 2023 (date code: 2312)
Revision History:September 08, 2022: Issued initial notification.January 5, 2023: Issued final notification. Attached the Qualification Report. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN. Provided estimated first ship date to be on March 21, 2023.Description of Change:Qualification of MMT as an additional assembly site for selected DSPIC33CK32Mx102 and DSPIC33CK64Mx102 device families available in 28L UQFN (4x4x0.6mm) package.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.
Microchip has released a new Errata for the dsPIC33CK64MC105 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Updated version issued for silicon revision A3.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Oct 2022
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for selected DSPIC33CK32Mx102 and DSPIC33CK64Mx102 device families available in 28L UQFN (4x4x0.6mm) package.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2022
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.