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DSPIC33EP32MC502-E/MM
Download the CAD models for this product. Learn more about SnapMagic.
61 per Tube
QFN-S28
Surface Mount
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Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Analog Multiplexer/Switch ICs, Analog to Digital Converters, CAN Controller, CAN Controller With Integrated Transceiver, Capacitive Touch Sensors, Current And Power Measurement Ics, Digital Signal Controllers, Digital to Analog Converters, Gate Drivers and Motor Drivers, Hybrid Controllers, Interface- Serial Peripherals, Power Management - PWM Controllers, SST Power Amplifiers, Ultrasound Transmitter Pulser ICs, Wireless Modules, Wireless Power And USB-PD ControllerNotification Subject: CCB 8425 Initial Notice: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Description of Change: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Pre and Post Summary Changes: See attached SPCN documentReason for Change: To improved manufacturability by qualifying 558-2C31 as a new die attach material at NSEB (UTL-1) site.Estimated Qualification Completion Date: November 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected dsPIC33EP128xx, dsPIC33EP256xx, dsPIC33EP32xx, dsPIC33EP512xx, DSPIC33EP64xx, PIC24EP128GP2xx, PIC24EP128MC2xx, PIC24EP256GP2xx, PIC24EP256MC2xx, PIC24EP32GP2xx, PIC24EP32MC2xx, PIC24EP512GP2xx, PIC24EP512MC2xx, PIC24EP64GP2xx and PIC24EP64MC2xx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.February 8, 2024: Re-issued final notification. Updated PCN title from initial notice to final notice. Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Pre and Post Change Summary: See attachedmpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 31, 2024 (date code: 2405)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Due to unforeseen circumstances, that are out of Microchip?s control, full qualification will be made available as soon as it is approved which may be after the estimated first ship date so that Microchip can maintain continuity of supply and not disrupt customer orders.Time Table Summary: see attached
Microchip has released a new Errata for the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated silicon issue 30.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 May 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for HA4583T-I/PT, HA4584T-I/PT catalog part numbers (CPN) and selected HA7619xxx, DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
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