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Manufacturer Part #
DSPIC33EV128GM006-E/PT
AEC-Q100, dsPIC™ 33EV Microcontroller IC 16-Bit 60 MIPs 128KB FLASH 64-TQFP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray | ||||||||||
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Product Specification
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 64L and 44L TQFP (10x10x1mm) package at MTAI assembly site.Pre Change:Using gold (Au) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wire.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date:March 15, 2020 (date code: 2012)
ERRATA - dsPIC33EVXXXGM00X/10X Family Silicon Errata and Data Sheet Clarification Microchip has released a new DeviceDoc for the dsPIC33EVXXXGM00X/10X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EVXXXGM00X/10X Family Silicon Errata and Data Sheet Clarification
Data Sheet - dsPIC33EVXXXGM00X/10X Family Data Sheet Microchip has released a new DeviceDoc for the dsPIC33EVXXXGM00X/10X Family Data Sheet of devices. Notification Status: FinalDescription of Change: This revision incorporates the following updates: 1) Sections: a) Updated Section 17.1 PWM Faults, Section 34.2 Package Details and Section 29.0 Development Support. 2) Registers: a) Updated Register 21-2 and Register 22-10. 3) Tables: a) Updated Table 1, Table 30-3, Table 30-8, Table 30-11, Table 30-22, Table 31-4 and Table 31-9. 4) Figures: a) Updated Figure 26-1. 5) Added 48-Pin package marking information.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 14 May 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new DeviceDoc for the dsPIC33EVXXXGM00X/10X Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: 1) Addition of silicon die revision AD. 2) Added data sheet clarification 2 (Electrical Characteristics)Reason for Change: To Improve ProductivityEstimated First Ship Date: 04 Mar 2019NOTE: Please be advised that after the estimated first ship date customers may receive pre and postchange parts.
Part Status:
Available Packaging
Package Qty:
160 per Tray