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Manufacturer Part #
DSPIC33FJ256MC510A-I/PF
Digital Signal Processors & Controllers - DSP, DSC 16Bit 40MIPS 256KB Flash
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Std. Mfr. Pkg | ||||||||||
| Date Code: | |||||||||||
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Description of Change:Implement new packing material (non-bakeable tray) for selected Atmel products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Pre Change:Use of bakeable tray packing material in MSL 3 requirementsPost Change:Use of non-bakeable tray packing material in MSL 1 requirementsReason for Change:To improve manufacturability and qualify new packing material (non-bakeable tray) in MSL 1 requirements.
Revision History:August 09, 2018: Issued initial notification.December 11, 2018: Issued final notification. Attached is the qualification report. Added estimated first ship date by January 11, 2019.March 8, 2019: Re-issued final notification to update the subject and description because of the update in scope to include products of 0.25um TSMC and 160K wafer technologies available in 64L TQFP package. Updated the affected CPN list in accordance with the update to the scope. Updated the pre and post change summary table MSL classification for MMT site from MSL 1 and 2 to MSL 3. Updated the pre and post change to add AP4200 die attach material and G631HQ mold compoundDescription of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm TSMC, 160K and 200K wafer technologies available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Pre Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 or AP4200 dieattach, G700 or G631HQ molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compoundand C7025 lead frame material.Post Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 or AP4200 dieattach, G700 or G631HQ molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compoundand C7025 lead frame material. Assembled at MMT using gold (Au) bond wire, 3280 die attach, G700 molding compound and C7025 lead frame material.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site.Estimated First Ship Date:For 100L TQFP package: January 11, 2019 (date code: 1902)For 64L TQFP package: March 30, 2019 (date code: 1913)
Revision History:August 09, 2018: Issued initial notification.December 11, 2018: Issued final notification. Attached is the qualification report. Added estimated first ship date by January 11, 2019.March 8, 2019: Re-issued final notification to update the subject and description because of the update in scope to include products of 0.25um TSMC and 160K wafer technologies available in 64L TQFP package. Updated the affected CPN list in accordance with the update to the scope. Updated the pre and post change summary table MSL classification for MMT site from MSL 1 and 2 to MSL 3. Updated the pre and post change to add AP4200 die attach material and G631HQ mold compound material for ANAP assembly site which is applicable for 64L TQFP package.Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm TSMC, 160K and 200K wafer technologies available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Pre Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 or AP4200 die attach, G700 or G631HQ molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead frame material.Post Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 or AP4200 die attach, G700 or G631HQ molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead frame material. Assembled at MMT using gold (Au) bond wire, 3280 die attach, G700 molding compound and C7025 lead frame material.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site.Estimated First Ship Date:For 100L TQFP package: January 11, 2018 (date code: 1902)For 64L TQFP package: March 30, 2019 (date code: 1913)
Final Notice: Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm TSMC and 200K wafer technology available in 100L TQFP (14x14x1mm) package.Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm TSMC and 200K wafer technology available in 100L TQFP (14x14x1mm) packagePre Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 die attach, G700 molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead frame material.Post Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 die attach, G700 molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead frame material. Assembled at MMT using gold (Au) bond wire, 3280 die attach, G700 molding compound and C7025 lead frame material.
Description of Change: Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm TSMC and 200K wafer technology available in 100L TQFP (14x14x1mm) package.Pre Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 die attach, G700molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead framematerial.Post Change:Assembled at ASAC using gold (Au) bond wire, 2200 die attach, G700 molding compound and C7025 lead frame material. Assembled at ANAP using gold (Au) bond wire, 3230 die attach, G700molding compound and C194 lead frame material. Assembled at ASE using palladium coated copper (PdCu) bond wire, 1076WA die attach, G631H molding compound and C7025 lead framematerial. Assembled at MMT using gold (Au) bond wire, 3280 die attach, G700 molding compound and C7025 lead frame material.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site.Estimated Qualification Completion Date:November 2018
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ROHS Compliant -
Lead Free
Available Packaging
Package Qty:
90 per Std. Mfr. Pkg
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