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Manufacturer Part #
PIC24FJ128GB204-E/PT
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160 per Tray
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Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Digital Signal ControllersDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected DSPIC33EP64GS808xx, DSPIC33EP128GS808xx, DSPIC33EP128GS708xx, DSPIC33EP64GS708xx, PIC24FJ64GA308xx, PIC24FJ128GA308xx, PIC24FJ128GA306xx, PIC24FJ64GA306xx, PIC18F87J94xx, PIC18F85J94xx, PIC18F86J94xx, PIC18F66J94xx, PIC18F65J94xx, PIC18F67J94xx, PIC24FJ128GB204xx, PIC24FJ64GB204xx, PIC24FJ128GA204xx, PIC24FJ64GA204xx, PIC24FJ128GA406xx, PIC24FJ256GA406xx, PIC24FJ64GB406xx, PIC24FJ128GB406xx, PIC24FJ256GB406xx, PIC24FJ64GA406xx, PIC32MX274F256Dxx, PIC32MX154F128Dxx, PIC32MX174F256Dxx, PIC32MX254F128Dxx, PIC24FJ128GC006xx and PIC24FJ64GC006xx device families available in 44L and 64L TQFP (10x10x1mm) and 80L TQFP (12x12x1mm) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MTAI assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 07 October 2026 (date code: 2641)
Data Sheet - PIC24FJ128GB204 Family Data Sheet Data Sheet Document RevisionDescription of Change: This revision incorporates the following updates: 1) Registers: Register 26-1. 2) Tables: Table 33-4, Table 33-5, Table 33-6 and Table 33-21. 3) Package marking examples and package diagrams in Section 34.0 "Packaging Information" were updated.NOTE: Please be advised that this is a change to the document only the product has not been changed..
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
