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Manufacturer Part #
PIC24FJ256GB110T-I/PF
PIC24F Series 256 kB Flash 16 kB RAM 16-Bit SMT Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC24FJ256GB110T-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:August 10, 2023: Issued initial notification.June 05, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 23, 2025. Updated the notification subject and description change.Note: The change described in this PCN does not alter Microchip's current regulatory compliance regarding the material content of the applicable product.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected dsPIC33FJ6xx, PIC18F96J6xx, PIC18F97J6xx, PIC24FJ64Gxx, PIC24FJ128xx, PIC24FJ192xx, PIC24FJ256xx, PIC24FJ96Gxx, dsPIC33FJ2xx, PIC24HJ64Gxx, dsPIC33FJ1xx, PIC24HJ128xx, PIC24HJ256xx and dsPIC33FJ3xx device families available in 64L and 100L TQFP (14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire asnew wire material for selected DSPIC33FJ128xxx, DSPIC33FJ256xxx, DSPIC33FJxxGSxxx,DSPIC33FJxxMxxx, PIC18F9xJxx and PIC24FJxxxGxxx device families available in 64L and 100L TQFP(14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with goldflash (CuPdAu) bond wire.
Microchip has released a new Product Documents for the PIC24FJ256GB110 Family Silicon/Data Sheet Errata of devices. Notification Status: FinalDescription of Change:1) Added data sheet clarification issues 8 (Universal Serial Bus with On-The-Go Support (USB OTG)), 9 (Universal Serial Bus with On-The-Go Support (USB OTG)), 10 (Electrical Characteristics), 11 (Inter-integrated Circuit (I2C)) and 12 (Special Features).2) The USB OTG, SPI and I2C standards use the terminology ?Master? and ?Slave?. The equivalent Microchip terminology used in this document is ?Host? and ?Client?, respectively.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 09 Feb 2022
Part Status:
Microchip PIC24FJ256GB110T-I/PF - Technical Attributes
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 16kB |
| Speed: | 32MHz |
| No of I/O Lines: | 83 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART/USB OTG |
| Peripherals: | Brown-out Detect/LVD/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
TQFP-100
Mounting Method:
Surface Mount