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Manufacturer Part #
ATSAM3S1AB-AUR
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2000 per Std. Mfr. Pkg
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*** Update of FPCN 113131 - Location Change ***Revision History: May 16, 2025: Issued initial notification.July 13, 2026: Issued final notification. Attached the Qualification Report and PFAS Elimination and Die Attach_Explanation file. Added a 'Change (Yes/No)' column and specified die attach material if PFAS affected or PFAS-free in the Pre and Post Change Summary table. Provided estimated first ship date to be on August 13, 2026.Description of Change: Qualification of ANAP as an additional assembly site for selected ATSAM3S4AA-AUR, ATSAM3S2AA-AUR, ATSAM3S1AB-AUR, ATSAM3S2AA-AU, ATSAM3S4AA-AU, and ATSAM3S1AB-AU catalog part numbers (CPN) available in 48L LQFP (7x7x1.4mm) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying ANAP as an additional assembly site.Estimated First Ship Date: 13 August 2026 (date code: 2633)
Product Category: 32-Bit Microcontrollers, 8-Bit MicrocontrollersDescription of Change: Qualification of CRM-1076WA as a new die attach material for selected AT58H01A, AT91R48, AT91SAM7S32C, AT91SAM7S65, AT91SAM7SE32, AT91SAM7SE32B, AT91SAM7Sxxx, ATSAM3Nxx, ATSAM3S2A, ATSAM3S4A, ATSAM3S4C, ATSAM3S8B, ATSAM3S8C, ATSAM3SD8B, ATSAM3SD8C, ATSAM3Sxx, ATSAM3U1C, ATSAM3U1E, ATSAM3U2E, ATSAM3U4E, ATSAM3X4C, ATSAM3X8C and ATSAM3X8E device families available in various packages assembled at ASSH site.Reason for Change: To improve manufacturability by qualifying CRM-1076WA as a new die attach material. Estimated Qualification Completion Date: July 2026
Description of Change: Implement new carrier tape pocket design for selected ATSAM3S4A, ATSAM3S2A, ATSAM4S2A, ATSAM4S4A, ATSAM3S1A, ATSAM3N0AA, ATSAM3N1A, ATSAM4N8A, ATSAM3S2B, ATSAM3S4B, AT91SAM7S512, AT91SAM7S64, ATSAM3S1B, AT91SAM7S128, ATSAM3S8B, ATSAM4N16B, ATSAM4N8B, ATSAM4S16B, ATSAM4S8B, ATSAM4SD16B, ATSAM4SA16B, ATSAM4SD32B, ATSAM4S4BA and ATSAM4S4B device families available in 48L and 64L LQFP (10x10x1.4mm and 7x7x1.4mm) packages at ASSH assembly site.Reason for Change: To improve manufacturability by implementing new carrier tape design.Estimated First Ship Date: 06 January 2026 (date code: 2602)
Description of Change: Implement corner reinforcement on the inner box for selected AT91SAM7Sxxx, ATSAM3Nxxx, ATSAM3S1xx, ATSAM3S2xx, ATSAM3S4xx, ATSAM3S8xx, ATSAM3SD8CA, ATSAM4N16xx, ATSAM4N8xx, ATSAM4S16xx, ATSAM4S2xx, ATSAM4S4xxATSAM4S8xx, ATSAM4SA16xx, ATSAM4SD16xx and ATSAM4SD32xx device families available in 100L LQFP (14x14x1.4mm), 48L LQFP (7x7x1.4mm) and 64L LQFP (10x10x1.4mm) packages.Reason for Change: To improve productivity by implementing corner reinforcement on the inner boxEstimated First Ship Date: 31 October 2025 (date code: 2544)
Description of Change: Qualification of ANAP as an additional assembly site for selected ATSAM3S4AA-AUR, ATSAM3S2AA-AUR, ATSAM3S1AB-AUR, ATSAM3S2AA-AU, ATSAM3S4AA-AU, and ATSAM3S1AB-AU catalog part numbers (CPN) available in 48L LQFP (7x7x1.4mm) package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying ANAP as an additional assembly site.Estimated Qualification Completion Date: October 2025
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
