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ATSAM4LS8CA-AU
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90 per Tray
TQFP-100
Surface Mount
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Product Category: 32-Bit MicrocontrollersNotification Subject: CCB 8424 Final Notice: Qualification of MPHL as an additional final test site and scan and pack site for selected ATSAM4LC8C, ATSAM4LS8C, ATSAML10D14A, ATSAML10D15A, ATSAML10D16A, ATSAML11D14A, ATSAML11D15A, ATSAML11D16A, ATSAMD21J18, ATSAML21G16B, ATSAML21G17B, ATSAML21G18B, ATSAMD21J17 device families available in various packages.Description of Change: Qualification of MPHL as an additional final test site and scan and pack site for selected ATSAM4LC8C, ATSAM4LS8C, ATSAML10D14A, ATSAML10D15A, ATSAML10D16A, ATSAML11D14A, ATSAML11D15A, ATSAML11D16A, ATSAMD21J18, ATSAML21G16B, ATSAML21G17B, ATSAML21G18B, ATSAMD21J17 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MPHL as an additional final test site and scan and pack site.Estimated First Ship Date: 14 August 2026 (date code: 2633)
***UPDATE OF PCN110872***Revision History: February 12, 2025: Issued initial notification.March 23, 2026: Issued final notification. Added the "Change (Yes/No) column to the Pre- and Post- Change Summary table. Attached the Qualification Report. Provided estimated first ship date to be on May 05, 2026.Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as a new wire material for ATSAM4LS2CA, ATSAM4LC8CA, ATSAM4LS8CA, AT32UC3A1512, AT32UC3A1128, AT32UC3A1256, ATSAM4LC4CA, ATSAM4LS4CA, ATSAM4LC2CA, AT32UC3C1128C, AT32UC3C1256C, AT32UC3C1512C and AT32UC3C164C device families available in 100L TQFP (14x14x1mm) package assembled at MMT assembly siteReason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 05 May 2026 (date code: 2619)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of palladium-coated copper with gold flash (CuPdAu) as a new wire material for ATSAM4LS2CA, ATSAM4LC8CA, ATSAM4LS8CA, AT32UC3A1512, AT32UC3A1128, AT32UC3A1256, ATSAM4LC4CA, ATSAM4LS4CA, ATSAM4LC2CA, AT32UC3C1128C, AT32UC3C1256C, AT32UC3C1512C and AT32UC3C164C device families available in 100L TQFP (14x14x1mm) package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Revision History:September 7, 2023: Issued initial notification.October 18, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
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