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Référence fabricant
ATSAMA5D26C-CU
SAMA5D2 Series 3.3 V 500 MHz 32-BIT ARM-Based Microprocessor - LFBGA-289
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :119 par Tray | ||||||||||
| Code de date: | 2325 | ||||||||||
Microchip ATSAMA5D26C-CU - Spécifications du produit
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Microchip has released a new Errata for the SAMA5D2 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: Updated 1. Silicon Issue Summary. Added in 6. Controller Area Network (MCAN): - 6.13. Frame transmitted despite confirmed transmit cancellation for CAN-FD messages with more than 8 data bytes Added in 17. Secure Digital MultiMedia Card Controller (SDMMC): - 17.4. SDMMC I/O calibration does not workNOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:October 07, 2021: Issued initial notification.August 11, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 30, 2022. Revised the post change die attach material for ATK.Description of Change:Qualification of ATK as an additional assembly site for selected ATSAMA5D26 and ATSAMA5D27 device families available in 289L LFBGA (14x14x1.4mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATK as an additional assembly site.
Microchip has released a new Product Documents for the SAMA5D2 Series Silicon Errata and Data Sheet Clarification of devices.Description of Change:1) Updated 1. Silicon Issue Summary.2) Deleted from 6. Controller Area Network (MCAN):- Message order inversion when transmitting from dedicated Tx Buffers configured with same message ID. Reason for Change: To Improve Productivity Date Document Changes Effective: 15 Mar 2022
Microchip has released a new Product Documents for the SAMA5D2 Series Data Sheet of devices.Description of Change:1) Global: Editorial changes throughout.2) System Controller: Updated Block Diagram.3) External Memories: I/O Lines Usage vs. Operating Mode: updated unit.4) CPU System Bus Matrix (CPUMX)a) Block Diagram: added.b) Description: updated.c) Embedded Characteristics: updated.d) Remap: updated.5) 18. Matrix (H64MX/H32MX)a) Table Host to Client Access on H32MX: updated.b) Table Peripheral Identifiers:-updated PMC/PID1, PIT/PID3, WDT/PID4 and RSTC/PID73-updated Note(3)6) Watchdog Timer (WDT)a) Block Diagram: updated.b) Functional Description: updated.c) WDT_CR: updated LOCKMR description.7) Reset Controller (RSTC)a) Block Diagram: modified.b) Embedded Characteristics: updated.c) 32.768 kHz Crystal Oscillator Failure Detection Reset: added.d) Reset State Priorities: updated.e) RSTC_SR: updated RSTTYP description.f) RSTC_MR: added SCKSW at index 1, and description.8) Real-time Clock (RTC)a) Embedded Characteristics: updated.b) Waveform Generation: updated.c) RTC_CALR: updated.d) Updated bit descriptions in RTC_CR, RTC_MR, RTC_TIMALR, RTC_CALALR.9) Slow Clock Controller (SCKC)a) Description: updated.b) Block Diagram: updated.c) Functional Description: updated.10) Clock Generator: 12 MHz RC Oscillator Clock Frequency Adjustment: deleted.11) Power Management Controller (PMC)a) Throughout: SLCK renamed to TD_SLCK.b) Figure Main System Bus Clock Controller: updated.c) Programmable Clock Controller: updated.d) Asynchronous Partial Wake-Up: updated.e) Register Summary: offset 0x0110 now ?reserved?.f) Updated:- CKGR_MOR- PMC_IER- PMC_IDR- PMC_SR- PMC_IMR12) Parallel Input/Output Controller (PIO)a) General Purpose or Peripheral Function Selection: updated.b) Open-Drain Mode: added note.c) Input Glitch and Debouncing Filters: updated.13) DDR-SDRAM Controller (MPDDRC)a) Product Dependencies, Initialization Sequence: added new step in initialization sequencesb) MPDDRC_CR: updated DIS_DLL and NDQS descriptions.14) Static Memory Controller (SMC)a) Embedded Characteristics: updated NFC_RAM characteristics.b) HSMC_PMECCFG: updated SPAREEN and AUTO bit descriptions.15) DMA Controller (XDMAC)a) Updated memory-to-memory transfer information in:- XDMAC Transfer Software Operation- XDMAC Software Requirements- XDMAC_CC16) LCD Controller (LCDC)a) Embedded Characteristics: modified bullets on Output mode.b) Window Position, Size, Scaling and Striding Attributes: table title changed to ?Window Size? from ?YUV Mode and Window Size?.c) YUV Frame Buffer Memory Mapping: replaced ?interleaved? with ?packed? throughout.17) Gigabit Ethernet MAC (GMAC)a) Embedded Characteristics, Priority Queueing in the DMA: updated.b) 1588 Timestamp Unit: updated.c) Updated table Receive Buffer Descriptor Entry.d) Data Paths with Packet Buffers Included: modified figure (GMII becomes PHY TX Interface, PHY RX Interface) Updated MAC TransmitBlock.e) Interrupts: modified first sentence.f) GMAC_NCR: modified bit descriptions.g) GMAC_NCFGR: modified text for DBW and IRXER.h) GMAC_TSR: added text for TXGO and HRESP.i) GMAC_RBQB, GMAC_TBQB: modified text.j) GMAC_RXUDAR, GMAC_TXUDAR: added.18) USB Device High Speed Port (UDPHS)a) Block Diagram: updated.b) UDPHS_CTRL: updated EN_UDPHS bit description19) USB Host High Speed Port (UHPHS)a) UHPHS_ASYNCLISTADDR: removed sentence referring to non-existing UHPHS_CTRLDSSEGMENT register.b) Corrected reset values for:- UHPHS_HCSPARAMS- UHPHS_HCCPARAMS- UHPHS_PORTSCx20) Flexible Serial Communication Controller (FLEXCOM)a) Figure 46-2 and Figure 46-3: updatedb) RS485 Mode: Updated figure Example of RTS Drive with Timeguard and added Notc) Local Loopback Test Mode: addedd) Data Transfer:- Table SPI Bus Protocol Mode: modified- Figure titles modified to S
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Emballages disponibles
Qté d'emballage(s) :
119 par Tray
