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Manufacturer Part #
ATSAMD21E15B-AUT
ARM Microcontrollers - MCU 32TQFP,85C TEMP, GREEN, 3.3V, 48MHZ, TR
Microchip ATSAMD21E15B-AUT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMC20E1xx, ATSAMC21E1xx, ATSAMD20E1xx, ATSAMD21E1xx, ATSAMDA1E1xx, ATSAML10E1xx, ATSAML11E1xx, ATSAML21E1xx, PIC32CM1216JH01032, PIC32CM1216MC00032, PIC32CM1602GV00032, PIC32CM2532JH00032, PIC32CM2532JH01032, PIC32CM3204GV00032, PIC32CM3204JH00032, PIC32CM6408JH00032 and PIC32CM6408MC00032 device families available in 32L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 13 October 2025 (date code: 2542)*Revision History: August 27, 2025: Issued final notification. The new die attach material was qualified via PCN #CENO-16EGCZ399 on July 22, 2025.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Section DescriptionOrdering Information• Updated the Diagram to reflect the addition of OTP.SYSCTRL• Added a note to the BOD33RDY bitfield in the PCLKSR Register.• Removed obsolete content from the ONDEMAND bitfield in the DFLLCTRL Register.USB• Corrected verbiage in the Register description for the EPINTENSETn Register.Electrical Characteristics at 85°C• Updated the Min and Typ Characteristics for table 37-52 in DFLL48M Characteristics.Electrical Characteristics at 105°C• Updated the Min and Typ Characteristics for table 38-25 in DFLL48M Characteristics.Electrical Characteristics at 125°C• Updated the Min and Typ Characteristics for table 39-37 and 39-38 in DFLL48M Characteristics.• Updated the Min and Max Characteristics for table 39-42 in OSC32K Characteristics.AEC-Q100 125°C Specifications• Updated the Min, Typ, and Max Characteristics for table 40-49 in DFLL48M Characteristics.Schematic Checklist• Updated Table 45-5 with a new MHz rating in Crystal Oscillator.Reason for Change: To Improve Productivity Date Document Changes Effective: 28 Mar 2025
Description of Change:The following updates were performed in this revision:? Updated the document throughout to reflect new silicon revisions H, I, and J? Removed obsolete Data Sheet Clarifications? Added errata Device: 1.5.9 One-Time Programmable LockPlease be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
Notification Status: FinalDescription of Change:The following errata were added:? SERCOM: 1.15.15 USART in Auto-Baud Mode? TC: 1.17.3 DMA TriggerImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional final test site for selected ATSAMD21E15Bxxx and ATSAMD21E16Bxxx device families available in 32L TQFP (7x7x1.0mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test siteEstimated First Ship Date:June 30, 2022 (date code: 2227)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as an additional final test site for selected ATSAMD21E15Bxxx and ATSAMD21E16Bxxx device families available in 32L TQFP (7x7x1.0mm) package.mpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 202
Part Status:
Microchip ATSAMD21E15B-AUT - Technical Attributes
| Family Name: | SAMD21E |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 4kB |
| Speed: | 48MHz |
| No of I/O Lines: | 26 |
| InterfaceType / Connectivity: | I2C/I2S/LIN/SPI/USART/USB |
| Peripherals: | Brown-out Detect/DMA/POR/PWM |
| Number Of Timers: | 6 |
| Supply Voltage: | 1.62V to 3.63V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2000 per Reel
Package Style:
TQFP-32
Mounting Method:
Surface Mount
