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Manufacturer Part #
DF71364AD80FPV
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1 per Tray
LQFP-80
Surface Mount
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PCN Information:
****FPCN122502 DOCUMENT UPDATE:LOCATION AND TESTING CHANGE/ FROM PC-MCU-A048A/E TO PC-MCU-A048B/E ****Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU products Description of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.. Effective Date: 1/15/2027
Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU productsDescription of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.Effective Date: 1/15/2027
Description of Change: Applicable products: H8, H8S, H8SX, and SH family QFP/FQFP/LQFP/LFQFP/TFQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Description:The die-bond material will be changed. The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
