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Manufacturer Part #
PIC32CM6408PL10028-I/3LW
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91 per Tube
VQFN-28
Surface Mount
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected PIC18F2xx, PIC18F5xx, AVR64DDxx, AVR64DUxx, AVR16DDxx, AVR32DDxx, AVR16DUxx, AVR32DUxx, PIC32CMxx, PIC16F7xx, PIC16F1xx, AVR128DA48S, AVR32DA48S and AVR64DA48S device families, together with qualification of MTAI as an additional assembly site for PIC18F4xx, PIC18F5xx, AVR64DBxx, AVR32DBxx, AVR32SDxx, PIC32CMxx, PIC16F1xx, PIC18F2xx, AVR128DA48, AVR32DA48 and AVR64DA48 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and MTAI as an additional assembly site.
Product Category: 32-Bit MicrocontrollersNotification Subject: PIC32CM6408PL10028/32/48/64 Silicon Errata and Data Sheet ClarificationsDescription of Change:Added Erratum for silicon Rev. A1:? SUPC: SUPC Events Not Generated in Standby Sleep ModeAdded Data Sheet Clarification:? Analog-to-Digital Converter: ADC - Analog-to-Digital Converter? Electrical Characteristics: Electrical Characteristics @125?CDate Document Changes Effective: 02 February 2026
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.