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Manufacturer Part #
R5F51115ADFM#3A
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160 per Tray
LQFP-64
Surface Mount
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Description of Change:Renesas will add full tray packaging to MCU products in addition to fractional and full carton.The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.Renesas plan to discontinue production of fractional tray packaging in the future.Regarding full tray production lot management, up to three production lots may be combined.Reason for Change:Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Description of Change:Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).Reason for Change:The new materials are already proven and used for other products in RSB assembly.No samples planned because the changed materials are already well known and used in mass production for other products.To ensure stable supply
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.