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Manufacturer Part #
R5F562TABDFM#V1
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160 per Tray
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Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Description of Change: Change of die-bond material (new die bond material already proven for mass production at ?Suzhou? factory Reason for Change: To change to an alternate material due to the supply termination of current die bond material manufacturer
Description of Change:Renesas will add full tray packaging to MCU products in addition to fractional and full carton.The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.Renesas plan to discontinue production of fractional tray packaging in the future.Regarding full tray production lot management, up to three production lots may be combined.Reason for Change:Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
