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Manufacturer Part #
R5F562TAEDFM#V1
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25 per Tray
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Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Description of Change: Change of die-bond material (new die bond material already proven for mass production at ?Suzhou? factory Reason for Change: To change to an alternate material due to the supply termination of current die bond material manufacturer
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
