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Manufacturer Part #
R5F562TAEDFP#V3
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90 per Tray
LQFP-100
Surface Mount
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Description of Change: Applicable products: RX Family RX100/200/600/700 Series LQFP-64 and LFQFP-80/100/144 pin products.The back-end factory: Renesas Semiconductor (Beijing) Co., LtdChanges: The lead frame will be changed.Reason for Change: To ensure a stable supply.
Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Description of Change: Change of lead frame. The wire length between the chip and lead frame inside the package is shortened at the inner lead portion. Package outline, die bond, mold resin and marking remain unchanged. Reason for Change: To ensure stable supply
Description of Change: Change of die-bond material (new die bond material already proven for mass production at ?Suzhou? factory Reason for Change: To change to an alternate material due to the supply termination of current die bond material manufacturer
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
