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Manufacturer Part #
R7S721034VCBG#AC0
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1 per Tray
LFBGA-176
Surface Mount
Shipping Information:
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PCN Information:
Subject: Transfer of the wafer production site, and Transfer of the Final Test, Visual Inspection, and Packing site for the RZ/A1M, RZ/A1LU, and RZ/A1LC groups Description of Change: The wafer production site for the target products will be transferred to Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC). In addition, the Final test, Visual inspection, and Packing sites for the target products will be transferred from Yonezawa factory to Tera Probe, Inc. Reason for Change: To ensure stable supply and enhance competitiveness, Renesas is pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, for RZ/A1M, RZ/A1LU, and RZ/A1LC MCU product groups, the wafer production site will be transferred to TSMC, and the final test, visual inspection, and packing site will be transferred to Tera Probe.Sample Availability Date : 7/15/2026
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
