Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
AT90CAN128-16AUR
Download the CAD models for this product. Learn more about SnapMagic.
1000 per Reel
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Cancellation of FPCN 118627 - Wire Material Change ***Revision History: January 21, 2026: Issued initial notification.March 27, 2026: Issued cancellation notification.Description of Change: This qualification was initially performed to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.
*** Update of FPCN 119715 - Tape & Reel Change ***Revision History: March 10, 2026: Issued final notification.March 12, 2026: Re-issued final notification to update the Pre and Post change attachment title from Lead frame to Reel.Description of Change: Implement new plastic reel for selected AT90CANxx, AT90USB128x, AT90USB64x, ATMEGA169P, ATMXT1067TDx, ATMXT1296M1x, ATMXT225Txx, ATMXT2496M1x, ATMXT449Txx, ATMXT540E-A, ATMXT641Txx, ATMXT768E-A, ATSAM4Cxx, ATSAM4LCxx, ATSAM4LSxx, ATSAMC20N17A, ATSAMC21N1xx, ATSAMD51Nxx, ATSAMD51Pxx, ATSAME51Nxx, ATSAME53Nxx, ATSAME54Nxx, ATSAME54Pxx, ATSAML22N1xx, ATUC3T, ATxmega64D3, PIC32CK2051SG01100, PIC32CX1025Mxx, PIC32CX2051MTxx, PIC32CX5112MTxx, PIC32CZ2051CA70100 device families available in various packages.Reason for Change: To improve manufacturability by implementing new plastic reel.Estimated First Ship Date: 04 May 2026 (date code: 2619)
Description of Change: Implement new plastic reel for selected AT90CANxx, AT90USB128x, AT90USB64x, ATMEGA169P, ATMXT1067TDx, ATMXT1296M1x, ATMXT225Txx, ATMXT2496M1x, ATMXT449Txx, ATMXT540E-A, ATMXT641Txx, ATMXT768E-A, ATSAM4Cxx, ATSAM4LCxx, ATSAM4LSxx, ATSAMC20N17A, ATSAMC21N1xx, ATSAMD51Nxx, ATSAMD51Pxx, ATSAME51Nxx, ATSAME53Nxx, ATSAME54Nxx, ATSAME54Pxx, ATSAML22N1xx, ATUC3T, ATxmega64D3, PIC32CK2051SG01100, PIC32CX1025Mxx, PIC32CX2051MTxx, PIC32CX5112MTxx, PIC32CZ2051CA70100 device families available in various packages.Reason for Change: To improve manufacturability by implementing new plastic reel.Estimated First Ship Date: 04 May 2026 (date code: 2619)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for AT90CAN128-16AU, AT90CAN128-16AUR, AT90USB1286-AU, AT90USB1286-AUR, AT90USB1287-AU, AT90USB1287-AUR, AT90USB646-AU, AT90USB646-AUR, AT90USB647-AU, AT90USB647-AUR, ATMEGA1280-16AU, ATMEGA1280-16AU-HCM, ATMEGA1280-16AUR, ATMEGA1280V-8AU, ATMEGA1280V-8AUR, ATMEGA1281-16AU, ATMEGA1281-16AUR, ATMEGA1281V-8AU, ATMEGA1281V-8AUR, ATMEGA2560-16AU, ATMEGA2560-16AU-HCM, ATMEGA2560-16AUR, ATMEGA2560V-8AU, ATMEGA2560V-8AUR, ATMEGA2561-16AU, ATMEGA2561-16AUR, ATMEGA2561V-8AU, ATMEGA2561V-8AUR, ATMEGA640-16AU, ATMEGA640-16AUR, ATMEGA640-16AURA0, ATMEGA640V-8AU and ATMEGA640V-8AUR catalog part numbers (CPN) available in 64L and 100L TQFP (14x14x1mm) package assembled at MMT site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Estimated First Ship Date: 26 May 2026 (date code: 2622)*Final Notification
Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Estimated Qualification Completion Date: April 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
