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Manufacturer Part #
ATMEGA128L-8MUR
IC 8 BIT, Microcontroller, 128KB FLASH In a 64 pin VQFN package
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Reel Package Style:QFN-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch waferImpacts to Data Sheet:None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Due to unforeseen circumstances, that are out of Microchip�s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new fabrication site as soon as possible as to not disrupt customer orders. Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch wafer Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Due to unforeseen business conditions, Microchip Technology Tempe Fab 2 (TMGR) has been qualified as a additional fabrication site effective immediately. Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.January 22, 2020: Re-issued initial notification to revise the Affected CPN list based on the updated scope.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date:June 2020
Description of Change:Qualification of Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6inch wafer or Fabricated at Microchip Technology Gresham Fab 4 (GRTM) using 8inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source Microchip Technology Gresham Fab 4 (GRTM).Estimated Qualification Completion Date:June 2020
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.
Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date: June 2020
Part Status:
Technical Attributes
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| Speed: | 8MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | 2-Wire / Serial |
| Number Of Timers: | 1 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Moisture Sensitivity Level: | 3 |
| Package Style: | QFN-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per Reel
Package Style:
QFN-64
Mounting Method:
Surface Mount