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ATMEGA324A-AU
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160 per Tray
TQFP-44
Surface Mount
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*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
*** Update for PCN 113300 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material. Estimated First Ship Date: 22 July 2025 (date code: 2530)Revision History: May 30, 2025: Issued final notification.June 03, 2025: Re-issued final notification to update lead-frame material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 22 July 2025 (date code: 2530)
PCN Status:Final NotificationDescription of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:September 23, 2024 (date code: 2439)
Revision History:September 27, 2023: Issued initial notification.June 24, 2024: Issued cancellation notification.PCN Status:Cancellation NotificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx, ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
Description of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.
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