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ATMEGA324PB-AUR
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2000 per Reel
TQFP-44
Surface Mount
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PCN Information:
Product Category: 8-Bit Microcontrollers, Capacitive Touch SensorsNotification Subject: CCB 8273 Final Notice: Qualification of OSE as an additional final test site and additional scan and pack site for selected ATmega16, AT42QT1481, ATmega324PB, AT42QT2640, ATmega2561 and ATmega328PB device families available in various packages.Description of Change: Qualification of OSE as an additional final test site and additional scan and pack site for selected ATmega16, AT42QT1481, ATmega324PB, AT42QT2640, ATmega2561 and ATmega328PB device families available in various packagesPre and Post Summary Changes:Pre Change: ASE Test(ASE9)Post Change: ASE Test(ASE9)Note: See attached SPCN document for more detailed descriptionReason for Change: To improve manufacturability and on-time delivery performance by qualifying OSE as an additional final test site and additional scan and pack site.Change Implementation Status: In ProgressEstimated First Ship Date: 04 September 2026 (date code: 2636)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for PIC16F15276, ATmega324PB, PIC16F13274, PIC16F13275, PIC16F13276, PIC16F15274, PIC16F15275, PIC16F17174, PIC16F17175, PIC16F17176, PIC16F17574, PIC16F17575, PIC16F17576, PIC16F18074, PIC16F18075, PIC16F18076, PIC16F18174, PIC16F18175 and PIC16F18176 device families available in 44L TQFP (10x10x1mm) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more details.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MTAI assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 23 July 2026 (date code: 2630)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/P based on the updated scope. Updated subject notification, reason for change and qual title accordingly.October 28, 2022: Re-issued final notification with qual report. Updated Estimated Implementation and Estimated First Ship date to November 10, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/PT based on the updated scope. Updated subject notification, reason for change and qual title accordingly.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
