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Manufacturer Part #
ATMEGA329PV-10MUR
ATmega Series 32 KB Flash 2 KB SRAM 10 MHz 8-Bit Microcontroller - QFN-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Reel Package Style:QFN-64EP Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATMEGA329PV-10MUR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN103080***Revision History: January 26, 2024: Issued initial notification.July 31, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on August 11, 2025.Description of Change: Qualification of ASEM as an additional assembly site for selected ATMEGA128x, ATMEGA165xx, ATMEGA169xx, ATMEGA64x, ATMEGA645xx, ATMEGA649xx, ATMEGA329xx, and ATMEGA325xx device families available in 64L VQFN (9x9x1mm) package.Reason for Change: To improve on-time delivery performance by qualifying ASEM as an additional assembly site.Estimated First Ship Date: 11 August 2025 (date code: 2533)
Description of Change: Qualification of ASEM as an additional assembly site for selected ATMEGA128x, ATMEGA165xx, ATMEGA169xx, ATMEGA64x, ATMEGA645xx, ATMEGA649xx, ATMEGA329xx, and ATMEGA325xx device families available in 64L VQFN (9x9x1mm) package.Reason for Change: To improve on-time delivery performance by qualifying ASEM as an additional assembly site.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700LA as a new mold compound material for selected ATMEGA64xx, ATMGA16xx, ATMEGA25xx and ATMEGA32xx device families available in 64L VQFN (9x9x1.0 mm) package.Reason for Change:To improve manufacturability by qualifying G700LA as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:December 23, 2022 (date code: 2252)
Description of Change:Qualification of G700LA as a new mold compound material for selected ATMEGA64, ATMGA16, ATMEGA25 AND ATMEGA32 device families available in 64L VQFN (9x9x1.0 mm) package. Pre and Post Change Summary: See attached.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as new mold compound material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 14, 2022Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
Microchip ATMEGA329PV-10MUR - Technical Attributes
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 2kB |
| Speed: | 10MHz |
| No of I/O Lines: | 54 |
| InterfaceType / Connectivity: | SPI/UART/USART/USI |
| Peripherals: | Brown-out Detect/LCD/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-64EP |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per Reel
Package Style:
QFN-64EP
Mounting Method:
Surface Mount