Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
ATMEGA640V-8AUR
Download the CAD models for this product. Learn more about SnapMagic.
1500 per Reel
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Cancellation of FPCN 118627 - Wire Material Change ***Revision History: January 21, 2026: Issued initial notification.March 27, 2026: Issued cancellation notification.Description of Change: This qualification was initially performed to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for AT90CAN128-16AU, AT90CAN128-16AUR, AT90USB1286-AU, AT90USB1286-AUR, AT90USB1287-AU, AT90USB1287-AUR, AT90USB646-AU, AT90USB646-AUR, AT90USB647-AU, AT90USB647-AUR, ATMEGA1280-16AU, ATMEGA1280-16AU-HCM, ATMEGA1280-16AUR, ATMEGA1280V-8AU, ATMEGA1280V-8AUR, ATMEGA1281-16AU, ATMEGA1281-16AUR, ATMEGA1281V-8AU, ATMEGA1281V-8AUR, ATMEGA2560-16AU, ATMEGA2560-16AU-HCM, ATMEGA2560-16AUR, ATMEGA2560V-8AU, ATMEGA2560V-8AUR, ATMEGA2561-16AU, ATMEGA2561-16AUR, ATMEGA2561V-8AU, ATMEGA2561V-8AUR, ATMEGA640-16AU, ATMEGA640-16AUR, ATMEGA640-16AURA0, ATMEGA640V-8AU and ATMEGA640V-8AUR catalog part numbers (CPN) available in 64L and 100L TQFP (14x14x1mm) package assembled at MMT site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Estimated First Ship Date: 26 May 2026 (date code: 2622)*Final Notification
Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Estimated Qualification Completion Date: April 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Errata for the ATmega640/1280/1281/2560/2561 Silicon Errata and Data Sheet Clarification of devices.Description of Change:The initial release of this document? Errata content moved from the data sheet and restructured to the new document template? Data sheet clarifications added:? Packaging Information: 3.2.1. 100-Ball CBGA? System Clock and Clock Options: 3.3.1. System Clock and Clock Options? Output Compare Modulator: 3.4.1. Output Compare Modulator in ATmega640/1280/1281/2560/2561? Interrupts: 3.5.1. Interrupt Vectors in ATmega640/1280/1281/2560/2561
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
