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Manufacturer Part #
ATTINY104-SSNR
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3000 per Reel
SOIC-14
Surface Mount
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for ATTINY102F-SSF, ATTINY102F-SSFR, ATTINY102F-SSN, ATTINY102FSSNR, ATTINY102-SSF, ATTINY102-SSFR, ATTINY102-SSN, ATTINY102-SSNR, ATTINY104SSF, ATTINY104-SSFR, ATTINY104-SSN and ATTINY104-SSNR catalog part numbers (CPN) available in 14L SOIC (.150in) package assembled at MMT site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire materialEstimated First Ship Date: 14 July 2026 (date code: 2629)
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
Description of Change: Qualification of MTAI as a new final test site for selected ATTINY102 and ATTINY104 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change: To improve manufacturability by qualifying MTAI as the new final test site
Description of Change:Qualification of MTAI as a new final test site for selected ATTINY102 and ATTINY104 device families available in 8L SOIC (3.90mm) and 14L SOIC (.150in) packages.Reason for Change:To improve manufacturability by qualifying MTAI as the new final test site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
