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Manufacturer Part #
AVR128DA64-I/PT
AVR-DA Series 128 kB Flash 16 kB SRAM 24 MHz 8-Bit Microcontroller - TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
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Microchip AVR128DA64-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of QMI519 as a new die attach material for AVR64DA64, AVR64DB64, AVR128DA64 and AVR128DB64 device families available in 64L TQFP (10x10x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying QMI519 as a new die attach material.
PCN Status:Initial NotificationDescription of Change:Qualification of QMI519 as a new die attach material for AVR128DA64-E/PT, AVR128DA64-I/PT, AVR128DA64T-I/PT, AVR128DA64T-E/PT, AVR64DA64-E/PT, AVR64DA64-I/PT, AVR64DA64T-I/PT, AVR64DA64T-E/PT, AVR128DB64-E/PT, AVR128DB64-I/PT, AVR128DB64T-I/PT, AVR128DB64T-E/PT, AVR64DB64-E/PT, AVR64DB64-I/PT, AVR64DB64T-I/PT, and AVR64DB64T-E/PT available in 64L TQFP (10x10x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change: Updates and improvements on the following sections – Document, Features, Device, CPU, NVMCTRL, CLKCTRL, SLPCTRL, RSTCTRL, CPUINT, EVSYS, PORT, BOD. WDT, TCA, TCB, TCD, RTC, USART, SPI, TWI, CCL. AC, ADC, DAC, ZCD, UPDI, Electrical Characteristics and Package Marking Information.Reason for Change: To Improve Productivity
Microchip has released a new Document for the AVR128DA Silicon Errata and Data Sheet Clarification of devices. Description of Change:• Removed data sheet clarifications:– 3.1. Features– 3.2. FUSE- Configuration and User Fuses– 3.3. RSTCTRL - Reset Controller– 3.4. TWI - Two-Wire Interface– 3.5. Electrical Characteristics- Peripheral Power Consumption– 3.6. Electrical Characteristics - Memory Programming Specifications– 3.7. Electrical Characteristics - VREF– 3.8. Electrical Characteristics - DAC– 3.9. Electrical Characteristics - ADC
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AVR128DA64-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/avr128da64-i-pt-microchip-4126905
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AVR128DA64-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/avr128da64-i-pt-microchip-4126905
Microchip AVR128DA64-I/PT - Technical Attributes
| Family Name: | AVR-DA |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 24MHz |
| No of I/O Lines: | 55 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 22-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount