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Manufacturer Part #
AVR64DB48-I/PT
AVR-DB Series 64 kB Flash 8 kB SRAM 24 MHz 8-Bit Microcontroller - TQFP-48
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:250 per Tray Package Style:TQFP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2341 | ||||||||||
Microchip AVR64DB48-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of QMI519 as a new die attach material for selected PIC18F56K42, PIC18F55K42, PIC18F57Q43, PIC18F56Q83, PIC18F56Q84, AVR32DA48, PIC18F57Q83, PIC18F57Q84, PIC18F56Q43, PIC18F54Q71, PIC18F55Q71, PIC18F56Q71, AVR128DA48, PIC16F15385, PIC16F15386, AVR64DB48, AVR32DB48, AVR128DB48, AVR64DA48, PIC16F19186, PIC16F19185, PIC18F55Q43, PIC18F55Q24, PIC18F56Q24 and PIC18F57K42 device families available in 48L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying QMI519 as a new die attach material.Estimated First Ship Date: 23 June 2025 (date code: 2526)
Microchip has released a new Datasheet for the AVR64DB28/32/48/64 Data Sheet of devices. Notification Status: FinalDescription of Change:Editorial updatesUpdated terminology:– Master is replaced by host– Slave is replaced by clientThe Flash write/erase endurance is 1,000 cyclesImproved the Connection for Power Supply section (decoupling capacitors)Added a new connector for UPDI to Connection for UPDI Programming sectionAdded series resistor to the Connection for XTAL32K sectionAdded single cycle ALU operation to “Instruction Execution Timing”More detailed description of the CCP sectionNew version of the memory map imageAdded start address to the SRAM tableUpdated block diagramExpanded several sections of the Flash sectionExpanded description of the FLMAP bit field in the CTRLB registerExpanded description of the ERROR bit field in the STATUS registerEtc.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity Change Implementation Status: CompleteDate Document Changes Effective: 10 Dec 2024
Microchip has released a new Document for the AVR64DB28/32/48/64 Silicon Errata and Data Sheet Clarifications of devicesDescription of Change:• General editorial updates• Added Silicon Revision: B1• Added Errata:– Device: 2.2.2. Write Operation Lost if Consecutive Writes to Specific Address Spaces– NVMCTRL: 2.5.2. NVM_EEPROM_ERASE Command does Not Respect Write Protect– SPI: 2.6.1. Alternative 2 Pin Position is Non-Functional for SPI1 with 48-Pin Devices– TCD: 2.9.3. Halting TCD and Waiting for SW Restart Does Not Work if Compare Value A is 0 orDual Slope Mode is Used– TWI: 2.10.1. Flush Non-Functional– USART: 2.11.2. Receiver Non-Functional after Detection of Inconsistent Synchronization Field• Added Data Sheet Clarifications:– SPI: 3.2.1. SPI - Serial Peripheral Interface– SPI: 3.2.2. SPI - Serial Peripheral Interface– Electrical Characteristics: 3.5.1. I/O Pin Characteristics– Electrical Characteristics: 3.5.3. SPI
Part Status:
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Microchip AVR64DB48-I/PT - Technical Attributes
| Family Name: | AVR DB |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 8kB |
| Speed: | 24MHz |
| No of I/O Lines: | 40 |
| InterfaceType / Connectivity: | CANbus/I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 18-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | TQFP-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-48
Mounting Method:
Surface Mount